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Prime & Bond XP Bottle Refill rayMage imaging software Most Panoramic CMOS sensors use

SKU: 51575145756

4.3
USD111.25 USD139.25

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Description

Most Panoramic CMOS sensors use lower cost

3M Clinpro Glycine Prophy Powder

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stiff plastic material

Prime & Bond XP Bottle Refill rayMage imaging software Most Panoramic CMOS sensors usePrime & Bond XP Etch & Rinse Adhesive is a universal self priming dental adhesive designed to bond resin based, light cured restorative materials to enamel and dentin. It can be used as a light cure, self cure and dual cure adhesive. One bottle one coat system for all direct restorations Proven nanotechnology seals against microleakage True universal use capabilities

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