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Bunnell™ Reverse Finger Knuckle Bender Gel Pack hDc® Moisture Management Technology is

SKU: 72225916513

4.5
USD32.95 USD69.95

Pay in 4 interest-free payments of $8.24 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Jul 25 - Jul 30

Description

hDc® Moisture Management Technology is all about cool and dry

efficient and discreet

Performance Base: Suede to help prevent sliding inside shoes

Not only does it support the tissues and bones within your ankle joint

Bunnell™ Reverse Finger Knuckle Bender Gel Pack hDc® Moisture Management Technology isDynamically extends the PIP joint. Made of aluminum with felt pads. Allows for greater tension adjustment by adding more rubber bands, which are included. Felt pads provide three points of support for comfort and stability. Width of splint can be adjusted by bending the side wires. To size, measure length from MP joint to DIP crease.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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